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White Silkscreen 6 Layer PCB Black Solder Mask For Video Conference Device

Basic Information
Place of Origin: China
Brand Name: WITGAIN PCB
Certification: UL
Model Number: PCB000389
Minimum Order Quantity: 1 pcs/lot
Price: negotiable
Packaging Details: Vacuum bubble bag packaging
Delivery Time: 20 days
Payment Terms: T/T
Supply Ability: 100k pcs/month
Detail Information
No Of Layers:: 6 Layer Material:: FR4 TG>150
Place Of Origin:: ShenZhen Solder Mask Colour:: Black
Surface Technics:: ENIG 1U' Min Lind Space&Width:: 4/4 Mil
High Light:

Conference Device 6 Layer PCB

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Black Solder Mask 6 Layer PCB

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White Silkscreen PCB


Product Description

6 Layer PCB Black Solder Mask White Silkscreen Used In Video Conference Devices

 

 

 

Printed Circuit Board Features:

 

1  6 Layer printed circuit board used in video conference devices.

2  FR4 substrate material, tg 150 degree.

3  Black solder mask and white silkscreen.

4  ENIG, gold thickness 1U'

5  Finished pcb thickness 1.0mm.

6  35 um copper thcikness on each layer.

7  PCB file or gerber file should be offered by customer.

8  Customized printed circuit board.

 

 

Packing Specifications:

 

1 One vacuum pcb package should not be over 25 panels based on panel size.

2 The vacuum pcb package sealed must be free to tear, hole or any defects that may cause leakage.

3 The pcb package must be suitable to ensure effective vacuum sealing.

4 Every package must have desiccant and humidity indicator card on the inside of vacuum package.

5 Humidity indicator card target less than 10%.

 

 

 

 

S1150G Data Sheet:

 

S1150G
Items Method Condition Unit Typical Value
Tg IPC-TM-650 2.4.25 DSC 155
Td IPC-TM-650 2.4.24.6 5% wt. loss 380
CTE (Z-axis) IPC-TM-650 2.4.24 Before Tg ppm/℃ 36
After Tg ppm/℃ 220
50-260℃ % 2.8
T260 IPC-TM-650 2.4.24.1 TMA min >60
T288 IPC-TM-650 2.4.24.1 TMA min 30
Thermal Stress IPC-TM-650 2.4.13.1 288℃, solder dip -- pass
Volume Resistivity IPC-TM-650 2.5.17.1 After moisture resistance MΩ.cm 6.4 x 107
E-24/125 MΩ.cm 5.3 x 106
Surface Resistivity IPC-TM-650 2.5.17.1 After moisture resistance 4.8 x 107
E-24/125 2.8 x 106
Arc Resistance IPC-TM-650 2.5.1 D-48/50+D-4/23 s 140
Dielectric Breakdown IPC-TM-650 2.5.6 D-48/50+D-4/23 kV 45+kV NB
Dissipation Constant (Dk) IPC-TM-650 2.5.5.9 1MHz -- 4.8
IEC 61189-2-721 10GHz --
Dissipation Factor (Df) IPC-TM-650 2.5.5.9 1MHz -- 0.01
IEC 61189-2-721 10GHz --
Peel Strength (1Oz HTE copper foil) IPC-TM-650 2.4.8 A N/mm
After thermal Stress 288℃,10s N/mm 1.4
125℃ N/mm 1.3
Flexural Strength LW IPC-TM-650 2.4.4 A MPa 600
CW IPC-TM-650 2.4.4 A MPa 450
Water Absorption IPC-TM-650 2.6.2.1 E-1/105+D-24/23 % 0.1
CTI IEC60112 A Rating PLC 0
Flammability UL94 C-48/23/50 Rating V-0
E-24/125 Rating V-0

 

 

 

 

 

 

 

 

 

Contact Details
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