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TG170 10 Layer PCB Blind Vias Buried Hole Printed Circuit Board Immersion Gold

Basic Information
Place of Origin: China
Certification: UL
Model Number: PCB000386
Minimum Order Quantity: 1pcs/lot
Price: negotiable
Packaging Details: Vacuum package in bubble wrap
Delivery Time: 20 days
Payment Terms: T/T
Supply Ability: 100kpcs/Moth
Detail Information
Layer Count: 10 Layer Surface Treatment: Selective Immersion Gold
Drilling: Blind And Buried Holes TG Degree: TG170
Copper Thickness: 1oz,3oz,2oz,etc. Base Material: FR-4,High TG,FR-4/aluminum/ceramic/cem-3
Board Thickness: 1.6mm-3.2mm Surface Finishing: HASL,ENIG,HASL Lead Free
Product Name: Printed Circuit Board,ceramic Base Circuit Board Solder Mask Color: Green. Red. Blue. White. Black.Yellow
High Light:

TG170 10 Layer PCB


Immersion Gold 10 Layer PCB


Blind Vias PCB

Product Description

10 Layer Printed Circuit Board ISO 14001 Qualified Used In Medical Equipment


Material Data Sheet:


Items Method Condition Unit Typical Value
Tg IPC-TM-650 2.4.25 DSC 180
IPC-TM-650 DMA 185
Td IPC-TM-650 5% wt. loss 345
CTE (Z-axis) IPC-TM-650 2.4.24 Before Tg ppm/℃ 45
After Tg ppm/℃ 220
50-260℃ % 2.8
T260 IPC-TM-650 TMA min 60
T288 IPC-TM-650 TMA min 20
T300 IPC-TM-650 TMA min 5
Thermal Stress IPC-TM-650 288℃, solder dip -- 100S No Delamination
Volume Resistivity IPC-TM-650 After moisture resistance MΩ.cm 2.2 x 108
E-24/125 MΩ.cm 4.5 x 106
Surface Resistivity IPC-TM-650 After moisture resistance 7.9 x 107
E-24/125 1.7 x 106
Arc Resistance IPC-TM-650 2.5.1 D-48/50+D-4/23 s 100
Dielectric Breakdown IPC-TM-650 2.5.6 D-48/50+D-4/23 kV 63
Dissipation Constant (Dk) IPC-TM-650 1MHz -- 4.8
IEC 61189-2-721 10GHz --
Dissipation Factor (Df) IPC-TM-650 1MHz -- 0.013
IEC 61189-2-721 10GHz --
Peel Strength (1Oz HTE copper foil) IPC-TM-650 2.4.8 A N/mm
After thermal Stress 288℃,10s N/mm 1.38
125℃ N/mm 1.07
Flexural Strength LW IPC-TM-650 2.4.4 A MPa 562
CW IPC-TM-650 2.4.4 A MPa 518
Water Absorption IPC-TM-650 E-1/105+D-24/23 % 0.1
CTI IEC60112 A Rating PLC 3
Flammability UL94 C-48/23/50 Rating V-0
E-24/125 Rating V-0






Q1: What is Halogen-Free Solder Paste?

A1: Halogen-Free Solder Paste as the name suggests is a solder paste that does not contain Halogen. Fundamentally, halogens in solder paste refer to chlorine and bromine. Chlorine, is found in circuit boards, and is primarily in the form of residual materials left over from production of non-brominated epoxy resins used in board assembly. Bromine in electronics is usually added to organic materials such as a fire retardant known as brominated flame retardants (BFRs). In solder pastes bromide also play a significant role as activators. Activators are the chemicals that are added to solder fluxes to remove oxides from metal surfaces, and so allow them to join together to form a strong metallurgical bond.

Over last few years the electronics industry has been making a move to become "halogen-free" as this is more environmentally friendly. According to the JPCA-ES-01–2003, IEC 614249–2–21 and IPC 4101B standards set by industry bodies the limit for assembly halogen content is 900 ppm for, chlorine and bromine. The IEC and IPC standard bodies have set the limit for the total, combined amount of chlorine and bromine to be less than 1500 ppm.

Halogens considerably influence the wetting properties of solder paste. Halogens in solder pastes enable solder and solder pad deoxidation, which in turn boost the wetting properties of the solder paste thus improving its melting properties. Hence, they have a positive effect on the stencil life, thermal stability, the reflow process-window, as well as durability. The abandonment of halogens has a direct effect on the soldering process and other subsequent processes such as assembly cleaning. There can always be chances of poorly wetted solder joints while using halogen-free solder pastes. Also, the elimination of halogens as activators can result in head-in-pillow joints due to poor/inconsistent melting behaviour.

So, despite being an essential part of PCB world, why are halogens of concern?

There are both known and suspected risks associated with halogens in electronics. Since various halogens contained in solder pastes, are regarded as harmful to health and the environment, REACH and RoHS have banned the use of halogens. The main concern here is with the disposal of products containing halogens, particularly through incineration as a recovery method. Limits for halogens or halides are set by a number of industrial standards.

Contact Details

Phone Number : +8613826589739

WhatsApp : +8613826589739