| Place of Origin: | China |
|---|---|
| Brand Name: | WITGAIN PCB |
| Certification: | UL |
| Model Number: | PCB000386 |
| Minimum Order Quantity: | 1pcs/lot |
| Price: | negotiable |
| Packaging Details: | Vacuum package in bubble wrap |
| Delivery Time: | 20 days |
| Payment Terms: | T/T |
| Supply Ability: | 100kpcs/Moth |
| Layer Count: | 10 Layer | Application: | Consumer Electronics |
|---|---|---|---|
| Solder Mask: | Green Solder Mask | Surface Treatment: | Selective Immersion Gold |
| Drilling: | Blind And Buried Holes | TG Degree: | TG170 |
| Surface Finishing: | HASL,ENIG,Gold Finger,HASL Lead Free | Product Name: | Printed Circuit Board |
| Material: | FR4 CEM1 CEM3 Hight TG,FR-4 High TG FR-4 PTFE | Type: | Electronic Board |
| High Light: | HASL 10 Layer PCB,ENIG 10 Layer PCB,Buried Holes LED Printed Circuit Board |
||
10 Layer Printed Circuit Board ISO 14001 Qualified Used In Medical Equipment
Main Features:
1 10 Layer customized printed circuit board manufacturered based on customer's gerber files.
2 Used in consumer electronics
3 Material is FR4 S1000-2 TG170.
4 The finished board thickness is 1.0MM.
5 The finished copper thickness is 1/H/H/H/H/H/H/H/H/1 OZ.
6 Surface treatment is ENIG 2U'.
7 Drilling: L1-L2 0.1MM, L2-L3 0.1MM, L1-L10 0.2MM, L9-L10 0.1MM, L8-L9 0.1MM Laser Drilling
8 Lead time is around 20 working days.
Material Data Sheet:
| S1000-2 | |||||
| Items | Method | Condition | Unit | Typical Value | |
| Tg | IPC-TM-650 2.4.25 | DSC | ℃ | 180 | |
| IPC-TM-650 2.4.24.4 | DMA | ℃ | 185 | ||
| Td | IPC-TM-650 2.4.24.6 | 5% wt. loss | ℃ | 345 | |
| CTE (Z-axis) | IPC-TM-650 2.4.24 | Before Tg | ppm/℃ | 45 | |
| After Tg | ppm/℃ | 220 | |||
| 50-260℃ | % | 2.8 | |||
| T260 | IPC-TM-650 2.4.24.1 | TMA | min | 60 | |
| T288 | IPC-TM-650 2.4.24.1 | TMA | min | 20 | |
| T300 | IPC-TM-650 2.4.24.1 | TMA | min | 5 | |
| Thermal Stress | IPC-TM-650 2.4.13.1 | 288℃, solder dip | -- | 100S No Delamination | |
| Volume Resistivity | IPC-TM-650 2.5.17.1 | After moisture resistance | MΩ.cm | 2.2 x 108 | |
| E-24/125 | MΩ.cm | 4.5 x 106 | |||
| Surface Resistivity | IPC-TM-650 2.5.17.1 | After moisture resistance | MΩ | 7.9 x 107 | |
| E-24/125 | MΩ | 1.7 x 106 | |||
| Arc Resistance | IPC-TM-650 2.5.1 | D-48/50+D-4/23 | s | 100 | |
| Dielectric Breakdown | IPC-TM-650 2.5.6 | D-48/50+D-4/23 | kV | 63 | |
| Dissipation Constant (Dk) | IPC-TM-650 2.5.5.9 | 1MHz | -- | 4.8 | |
| IEC 61189-2-721 | 10GHz | -- | — | ||
| Dissipation Factor (Df) | IPC-TM-650 2.5.5.9 | 1MHz | -- | 0.013 | |
| IEC 61189-2-721 | 10GHz | -- | — | ||
| Peel Strength (1Oz HTE copper foil) | IPC-TM-650 2.4.8 | A | N/mm | — | |
| After thermal Stress 288℃,10s | N/mm | 1.38 | |||
| 125℃ | N/mm | 1.07 | |||
| Flexural Strength | LW | IPC-TM-650 2.4.4 | A | MPa | 562 |
| CW | IPC-TM-650 2.4.4 | A | MPa | 518 | |
| Water Absorption | IPC-TM-650 2.6.2.1 | E-1/105+D-24/23 | % | 0.1 | |
| CTI | IEC60112 | A | Rating | PLC 3 | |
| Flammability | UL94 | C-48/23/50 | Rating | V-0 | |
| E-24/125 | Rating | V-0 | |||
