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ENIG 2U Motor Driver 10 Layer PCB Assembly Printed Circuit Board IATF 16949

Basic Information
Place of Origin: China
Certification: UL
Model Number: 10LayerPCB0032
Minimum Order Quantity: 1pcs/lot
Price: negotiable
Packaging Details: Vacuum package in bubble wrap
Delivery Time: 20 days
Payment Terms: T/T
Supply Ability: 100kpcs/Moth
Detail Information
Board Thickness: 2.0MM Application: Motors
Solder Mask: Green Solder Mask Surface Treatment: ENIG 2U'
Material: FR4 TG Degree: TG180
High Light:

ENIG 2U 10 Layer PCB


10 Layer PCB Assembly


IATF 16949 Motor Driver PCB

Product Description

DC Motor Control PCB Assembly 10 Layer Printed Circuit Board IATF 16949



Material Data Sheet:


Items Method Condition Unit Typical Value
Tg IPC-TM-650 2.4.25 DSC 180
IPC-TM-650 DMA 185
Td IPC-TM-650 5% wt. loss 345
CTE (Z-axis) IPC-TM-650 2.4.24 Before Tg ppm/℃ 45
After Tg ppm/℃ 220
50-260℃ % 2.8
T260 IPC-TM-650 TMA min 60
T288 IPC-TM-650 TMA min 20
T300 IPC-TM-650 TMA min 5
Thermal Stress IPC-TM-650 288℃, solder dip -- 100S No Delamination
Volume Resistivity IPC-TM-650 After moisture resistance MΩ.cm 2.2 x 108
E-24/125 MΩ.cm 4.5 x 106
Surface Resistivity IPC-TM-650 After moisture resistance 7.9 x 107
E-24/125 1.7 x 106
Arc Resistance IPC-TM-650 2.5.1 D-48/50+D-4/23 s 100
Dielectric Breakdown IPC-TM-650 2.5.6 D-48/50+D-4/23 kV 63
Dissipation Constant (Dk) IPC-TM-650 1MHz -- 4.8
IEC 61189-2-721 10GHz --
Dissipation Factor (Df) IPC-TM-650 1MHz -- 0.013
IEC 61189-2-721 10GHz --
Peel Strength (1Oz HTE copper foil) IPC-TM-650 2.4.8 A N/mm
After thermal Stress 288℃,10s N/mm 1.38
125℃ N/mm 1.07
Flexural Strength LW IPC-TM-650 2.4.4 A MPa 562
CW IPC-TM-650 2.4.4 A MPa 518
Water Absorption IPC-TM-650 E-1/105+D-24/23 % 0.1
CTI IEC60112 A Rating PLC 3
Flammability UL94 C-48/23/50 Rating V-0
E-24/125 Rating V-0



Most PCB companies classify vias with a diameter less than 150 microns to be microvias. These vias lower the possibility of any type of manufacturing defect since they are drilled using lasers which mitigates the chances of any residue left after the process. Because of their small size and ability to connect one layer to the next they enable denser printed circuit boards with more complex designs. Most HDI printed circuit boards use microvias.


Microvias are used to connect one layer of the board to its adjacent layer and have a very small diameter in comparison to the mechanically drilled vias such as PTH (Plated Through Hole).


Microvias are of two types, Stacked and Staggered.


ENIG 2U Motor Driver 10 Layer PCB Assembly Printed Circuit Board IATF 16949 0

Contact Details

Phone Number : +8613826589739

WhatsApp : +8613826589739