Selective 6 Layer HDI Immersion Gold PCB With Blind / Buried Holes

Basic Information
Place of Origin: China
Certification: UL
Model Number: HDIPCB0011
Minimum Order Quantity: 1pcs/lot
Price: negotiable
Packaging Details: vacuum package in bubble wrap
Delivery Time: 25 days
Payment Terms: T/T
Supply Ability: 100kpcs/Month
Detail Information
Layer Count: 6 Layer PCB Kind: HDI PCB
Board Thickness: 1.0 MM Min Hole: 0.1MM
Solder Mask: Green Solder Mask Surface Treatment: Selective Immersion Gold
Material: S1000-2 BGA Size: 9 MIL
High Light:

HDI Immersion Gold PCB


6 Layer HDI Immersion Gold PCB


Immersion Gold Surface HDI PCB

Product Description

Selective Immersion Gold 6 Layer HDI PCB With Blind Holes And Buried Holes



PCB Specifications:  


1 Part NO: HDIPCB0011

2 Layer Count: 6 Layer HDI PCB

3 Finished Board Thickness: 1.0MM

4 Drilling: L1-L2 0.1MM, L2-L5 0.2MM, L5-L6 0.1MM, L1-L6 0.2MM 

5 Min Lind Space&Width: 2.8/2.7mil

6 Copper Thickness: 1/H/H/H/H1

7 Application Area: Smart Watch

8 PCB Size: 113.1MM*101.1MM/6PCS




Our production applications:


1 Consumer electronic products: SSD, TWS earphones, headsets,computer devices, portable power supplies, bluetooth modules, gps modules, wifi modules, smart keys for cars, intelligent locks, floor mopping robots, zigbee, etc.

2 Industrial control:main boards in machines, industrial robots, servo motors etc.

3 Automotive: BMS main boards, automotive radar etc.

4 Power supplies: UPS, industrial power supply, frequency power supply.

5 Medical: medical equipment, medical equipment power supply.

6 Communication products: 5G base station, routers, satellites, antennas.

7 Photovoltaic inverter





Items IPC TM-650 Typical Value Unit
Peel Strength, minimum
A. Low profile copper foil
B. Standard profile copper foil
2.4.8 5
Volume Resistivity 1x109 M-cm
Surface Resistivity 1x108 M
Moisture Absorption, maximum 0.10 %
Permittivity (Dk, 50% resin content)
A. 1MHz
B. 1GHz
Loss Tangent (Df, 50% resin content)
A. 1MHz
B. 1GHz
Flexural Strength, minimum
A. Length direction
B. Cross direction
2.4.4 500-530
Thermal Stress 10 s at 288°C
A. Unetched
B. Etched Pass Pass Rating
Flammability UL94 V-0 Rating
Comparative Tracking Index (CTI) IEC 60112 / UL 746 CTI 3 (175-249) Class (Volts)
Glass Transition Temperature(DSC) 2.4.25 175 ˚C
Decomposition Temperature 345 ˚C
X/Y Axis CTE (40to 125) 2.4.41 11-13 / 13-15 ppm/˚C
Z-Axis CTE
A. Alpha 1
B. Alpha 2
C. 50 to 260 Degrees C
2.4.24 45
ppm/˚C ppm/˚C
Thermal Resistance
A. T260
B. T288 >60
Minutes Minutes





Q1: What is the Thermal Resistance of a PCB?

A1: Thermal Resistance is a property of a printed circuit board that specifies its resistance to heat dispersion. A low thermal resistance in a PCB makes the dispersion of heat easier. This is basically the inverse of thermal conductivity. The thermal resistance of a PCB can be calculated by evaluating all the layers of the board and the heat parameters of the material.

To find the total thermal resistance for your board, you must include all layers of the board and the associated heat parameters for the type of material through which heat will flow.



R_theta = absolute thermal resistance (K/W) across the thickness of the sample

Delta x = thickness (m) of the sample (measured on a path parallel to the heat flow)

k = thermal conductivity (W/(K·m)) of the sample

A = cross-sectional area (m2) perpendicular to the path of heat flow


In addition to the thermal resistance of the board. The Thermal resistance of Vias must also be calculated. This usually depends on the copper trance, the laminate and the substrate and their respective thermal resistivities.

How can you reduce the Thermal Resistance of a PCB?

  • Thermal resistance can be reduced by increasing the thickness of the copper traces.
  • Another method to decrease the thermal resistance is to place copper pads below the hot components. The high thermal conductivity of copper provides a low resistance path for the dispersion of heat. These pads can be connected to an internal ground plane through vias, which have good thermal conductivity and thus help move heat away from the component.
  • Using Heat Sinks can help lower the thermal resistivity of the board.




Contact Details

Phone Number : +8613826589739

WhatsApp : +8613826589739