|Layer Count:||6 Layer||PCB Kind:||HDI PCB|
|Board Thickness:||1.0 MM||Min Hole:||0.1MM|
|Solder Mask:||Green Solder Mask||Surface Treatment:||Selective Immersion Gold|
|Material:||S1000-2||BGA Size:||9 MIL|
HDI Immersion Gold PCB,
6 Layer HDI Immersion Gold PCB,
Immersion Gold Surface HDI PCB
Selective Immersion Gold 6 Layer HDI PCB With Blind Holes And Buried Holes
1 Part NO: HDIPCB0011
2 Layer Count: 6 Layer HDI PCB
3 Finished Board Thickness: 1.0MM
4 Drilling: L1-L2 0.1MM, L2-L5 0.2MM, L5-L6 0.1MM, L1-L6 0.2MM
5 Min Lind Space&Width: 2.8/2.7mil
6 Copper Thickness: 1/H/H/H/H1
7 Application Area: Smart Watch
8 PCB Size: 113.1MM*101.1MM/6PCS
Our production applications:
1 Consumer electronic products: SSD, TWS earphones, headsets,computer devices, portable power supplies, bluetooth modules, gps modules, wifi modules, smart keys for cars, intelligent locks, floor mopping robots, zigbee, etc.
2 Industrial control:main boards in machines, industrial robots, servo motors etc.
3 Automotive: BMS main boards, automotive radar etc.
4 Power supplies: UPS, industrial power supply, frequency power supply.
5 Medical: medical equipment, medical equipment power supply.
6 Communication products: 5G base station, routers, satellites, antennas.
IT180A DATA SHEET:
|Items||IPC TM-650||Typical Value||Unit|
|Peel Strength, minimum
A. Low profile copper foil
B. Standard profile copper foil
|Moisture Absorption, maximum||184.108.40.206||0.10||%|
|Permittivity (Dk, 50% resin content)
|Loss Tangent (Df, 50% resin content)
|Flexural Strength, minimum
A. Length direction
B. Cross direction
|Thermal Stress 10 s at 288°C
|Comparative Tracking Index (CTI)||IEC 60112 / UL 746||CTI 3 (175-249)||Class (Volts)|
|Glass Transition Temperature(DSC)||2.4.25||175||˚C|
|X/Y Axis CTE (40℃ to 125℃)||2.4.41||11-13 / 13-15||ppm/˚C|
A. Alpha 1
B. Alpha 2
C. 50 to 260 Degrees C
A1: Thermal Resistance is a property of a printed circuit board that specifies its resistance to heat dispersion. A low thermal resistance in a PCB makes the dispersion of heat easier. This is basically the inverse of thermal conductivity. The thermal resistance of a PCB can be calculated by evaluating all the layers of the board and the heat parameters of the material.
To find the total thermal resistance for your board, you must include all layers of the board and the associated heat parameters for the type of material through which heat will flow.
R_theta = absolute thermal resistance (K/W) across the thickness of the sample
Delta x = thickness (m) of the sample (measured on a path parallel to the heat flow)
k = thermal conductivity (W/(K·m)) of the sample
A = cross-sectional area (m2) perpendicular to the path of heat flow
In addition to the thermal resistance of the board. The Thermal resistance of Vias must also be calculated. This usually depends on the copper trance, the laminate and the substrate and their respective thermal resistivities.
How can you reduce the Thermal Resistance of a PCB?