FR4 TG135 Double Layer PCB Board 0.8MM Immersion Gold Surface

Basic Information
Place of Origin: China
Certification: UL
Model Number: PCB00030
Minimum Order Quantity: 1 pcs/lot
Price: negotiable
Packaging Details: Vacuum bubble bag packaging
Delivery Time: 10 days
Payment Terms: T/T
Supply Ability: 100k pcs/month
Detail Information
No Of Layers: 2 Layer Material: FR4 TG>135
PCB Thickness: 0.8 MM Solder Mask Colour: Green
Surface Technics: Immersion Gold CU Thickness: 1OZ
High Light:

0.8MM Double Layer PCB Board


FR4 TG135 Double Layer PCB Board


Immersion Gold Surface 2 Layer PCB

Product Description

FR4 TG135 Double Layer PCB Board Immersion Gold



  • Main Features:


1 2 Layer FR4 substrate material printed circuit board.

2 Double layer copper, copper thickness is 35um/35um.

3 Finished pcb thickness is 0.8 mm.

4  Surface Treatment is immersion gold 1u'.

5  Used in consumer products.

6 2 layer pcb with 8/8mil min line space and width.

7 Green solder mask and white silkscreen.

8  Need customer to send us the gerber file or PCB file



  • Our Capabilities:
NO Item Capability
1 Layer Count 1-24 Layers
2 Board Thickness 0.1mm-6.0mm
3 Finished Board Max Size 700mm*800mm
4 Finished Board Thickness Tolerance +/-10% +/-0.1(<1.0mm)
5 Warp <0.7%
6 Major CCL Brand KB/NanYa/ITEQ/ShengYi/Rogers Etc
7 Material Type FR4,CEM-1,CEM-3,Aluminum,Copper, Ceramic, PI, PET
8 Drill Hole Diameter 0.1mm-6.5mm
9 Out Layer Copper Thickness 1/2OZ-8OZ
10 Inner Layer Copper Thickness 1/3OZ-6OZ
11 Aspect Ratio 10:1
12 PTH Hole Tolerance +/-3mil
13 NPTH Hole Tolerance +/-1mil
14 Copper Thickness of PTH Wall >10mil(25um)
15 Line Width And Space 2/2mil
16 Min Solder Mask Bridge 2.5mil
17 Solder Mask Alignment Tolerance +/-2mil
18 Dimension Tolerance +/-4mil
19 Max Gold Thickness 200u'(0.2mil)
20 Thermal Shock 288℃, 10s, 3 times
21 Impedance Control +/-10%
22 Test Capability PAD Size min 0.1mm
23 Min BGA 7mil
24 Surface Treatment OSP, ENIG,HASL, Plating Gold, Carbon Oil,Peelable Mask etc


  • FQA:


Q1: What is thermal resistance? How can the thermal resistance of a PCB be reduced?


A1: Thermal Resistance is a property of a printed circuit board that specifies its resistance to heat dispersion. A low thermal resistance in a PCB makes the dispersion of heat easier. This is basically the inverse of thermal conductivity. The thermal resistance of a PCB can be calculated by evaluating all the layers of the board and the heat parameters of the material.


To find the total thermal resistance for your board, you must include all layers of the board and the associated heat parameters for the type of material through which heat will flow.



R_theta = absolute thermal resistance (K/W) across the thickness of the sample

Delta x = thickness (m) of the sample (measured on a path parallel to the heat flow)

k = thermal conductivity (W/(K·m)) of the sample

A = cross-sectional area (m2) perpendicular to the path of heat flow


In addition to the thermal resistance of the board. The Thermal resistance of Vias must also be calculated. This usually depends on the copper trance, the laminate and the substrate and their respective thermal resistivities.

How can you reduce the Thermal Resistance of a PCB?

  • Thermal resistance can be reduced by increasing the thickness of the copper traces.
  • Another method to decrease the thermal resistance is to place copper pads below the hot components. The high thermal conductivity of copper provides a low resistance path for the dispersion of heat. These pads can be connected to an internal ground plane through vias, which have good thermal conductivity and thus help move heat away from the component.
  • Using Heat Sinks can help lower the thermal resistivity of the board.







Contact Details

Phone Number : +8613826589739

WhatsApp : +8613826589739