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2OZ Copper Double Layer Circuit Board Power Supply Product PCB

Basic Information
Certification: UL
Model Number: PCB000303
Minimum Order Quantity: 1 pcs/lot
Price: negotiable
Packaging Details: Vacuum bubble bag packaging
Delivery Time: 10 days
Payment Terms: T/T
Supply Ability: 100k pcs/month
Detail Information
Place Of Origin: Guangdong China Material: FR4 Middle TG
No Of Layers: 2 Layer Solder Mask Colour: Green
Surface Technics: HAL Lead Free Min Lind Space&Width: 7/7mil
High Light:

2OZ Copper Double Layer Circuit Board


1.6mm Double Layer Circuit Board


FR4 Middle TG 2 Layer PCB

Product Description

2 OZ Copper Power Supply Product PCB Double Layer Circuit Board



  • Main Features:


1 2 Layer FR4 substrate material printed circuit board.

2 Double layer copper, copper thickness is 70um/70um.

3 Finished pcb thickness is 1.6mm.

4 Used in power supply product..

5 ENIG+Carbon ink surface treatment.

6 2 layer pcb with 7/7mil min line space and width.

7 Green solder mask and white silkscreen.

8  Need customer to send us the gerber file or PCB file



  • Our Equipment List:


NO Equipment Name Equipment Brand Equipment QTY
1 Automatic Cutting SCHCLLING-CA6858 1
2 Roll Cutting QIXIAN 2
3 Vertical Cutting SHANGYUE 2
4 Innerlayer pretreatment JIECHI 4
5 Automatic coat&wiring QUNYU 4
6 Automatic exposure CHUANBAO 11
7 Large table exposure HECHUAN 2
8 Laser Plotter ORBOTEC 3
9 Etching line KB 4
10 PE Punching PE-3000 1
12 Double row brown KB 3
13 PP Cutting ZHENGYE 5
14 PP Chopping ZHONGDA 2
15 Hot-melt machine HANSONG 6
16 Riveting machine JIAOSHI 6
17 X-Ray Check HAOSHUO 5
18 Automatic reflux LANDE 2
19 Steel plate washer FENGKAI 2
20 Large size press DATIAN 8热4冷
21 X-Ray Drilling target HAOSHUO 8
22 Ccd Drilling target XUELONG 10
23 Automatic grinding XINHAO 5
24 Plate thickness Measuring AISIDA 2
25 Four axis gongs machine DALIANG 2
26 Two axis gongs machine BIAOTEFU 4
27 Automatic grinding mill JIEHUI 2
28 Drilling machine TONGTAI 13
29 Hole testing machine YAYA 1
30 Sinking rough mill KB 1
31 Vertical copper wire YAMEI 1
32 Automatic electroplating line JINMING 1
33 Dryer after electroplating KB 1
34 Etch machine KB 1
35 Film checking machine YUBOLIN 2
36 Line pre-processing KB 2
37 Automatic laminator ZHISHENG 3
38 Outer exposure machine CHUANBAO 8
39 Outer exposure machine HECHUAN 3
40 Etch machine JULONG 1
41 Line developing machine KB 1
42 Sand blasting machine KB 1
43 Precoarsening pretreatment KB 2
44 Electrostatic spraying line FURNACE 1
45 Automatic screen printing machine HENGDAYOUCHUANG 12
46 Pre baked tunnel furnace KB 1
47 Solder resist exposure machine CHUANBAO 6
48 Solder resist exposure machine HECHUAN 2
49 Post baked tunnel furnace GC0-77BD 2
50 Solder resist developing machine KB 1
51 Screen printing machine 1.8mm/2.0mm 4
52 Character baking tunnel furnace GC0-77BD 1
53 Sunk Tin spray line   2
54 Nickel palladium and gold wire XINHUAMEI 1
55 Alternator   2
56 OSP line KB 1
57 Gongs machine YIHUI 20
60 Hydraulic punch press SRT 2
61 Test machine MASON 17
62 High speed flying needle tester WEIZHENGTAI 3
63 Four wire flying needle tester XIELI 2
64 Product washing machine KB 2
65 Plate warping machine XINLONGHUI 2
66 Vacuum packaging machine SHENGYOU 4



  • FQA:


Q1: What is Backdrilling in PCB Fabrication?




2OZ Copper Double Layer Circuit Board Power Supply Product PCB 0


Back drilling or Controlled depth drilling is a process used to remove the unwanted portion of a PCB Via Stub. Plated Through Hole (PTH) Vias are used to connect two or more layers of a Printed Circuit Board to each other. However often, a via does not need to run the entire thickness of the board to connect each layer. For example, if we have a 10 layer PCB and need to connect layer 1 to layer 3 using a via, the PTH via runs through all the layers of the PCB even though layers 3 to 10 do not need to be connected to each other using that particular via. This unused portion of the via is called a stub. These stubs can cause significant signal distortion (click here to read more about PCB via Stubs).

Backdrilling is a technique used to remove the unused portion of the stub (conductive plating) in a printed circuit board. This is removed by using a drill that has the diameter slightly larger than the diameter of the original via (PTH) hole. In practice, it is achieved by re-drilling the PTH down to a predetermined stub length of less than 10 mils from the signal layer.


2OZ Copper Double Layer Circuit Board Power Supply Product PCB 1


In case the via is connecting two internal layers only, then it is necessary to remove the top and bottom stub to improve the high-speed signal quality (see figure below). Backdrilling is a cost-effective solution as compared to the lamination technique (used for blind and buried vias) to manage the signal quality in a high-speed signal bath. If properly executed, it will not affect the performance and reliability of the PCB.


2OZ Copper Double Layer Circuit Board Power Supply Product PCB 2


How does the stub length distort the signal quality?


When a signal flows down the length of a via, it splits into two parts at the junction between the internal layer and stub. One part travels towards the receiver end through the internal layer, and the other part travels towards the stub end. The stub act as an unterminated transmission line, so the signal reflects back towards the junction. At the junction, the signal again split into two with one signal returning to the source, and the other following the trace. Hence, the source signal is disturbed. The source distortion is the main cause for deterministic jitter (deviation clock pulse edge from its original position). Then the deterministic jitter leads to an increase in Bit error rates (BER), cross talk, EMI/EMC radiation, and the attenuation.






Contact Details

Phone Number : +8613826589739

WhatsApp : +8613826589739