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Red Solder Mask FR4 Circuit Board 1 OZ Copper Thickness OSP Treatment

Basic Information
Place of Origin: China
Brand Name: WITGAIN PCB
Certification: UL
Model Number: Multi-Layer PCB000352
Minimum Order Quantity: 1 pcs/lot
Price: negotiable
Packaging Details: Vacuum bubble bag packaging
Delivery Time: 20 days
Payment Terms: T/T
Supply Ability: 100k pcs/month
Detail Information
No Of Layers: 8 Layers Solder Mask: Red Solder Mask
Min Hole Size: 0.15MM CU Thickness: 1 OZ
Impedance Control: 50 Ohm Min Lind Space&Width: 3.5/3.5 Mil
High Light:

Red Solder Mask FR4 Circuit Board

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1OZ Copper FR4 Circuit Board

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OSP Treatment Multilayer Circuit Board


Product Description

Red Solder Mask FR4 Substrate Material 1 OZ Copper Thickness OSP Treatment

 

 

PCB Specifications:

 

1 Part NO: Multi-Layer PCB000351

2 Layer Count: 8 Layer  PCB

3 Finished Board Thickness: 1.6MM

4 Copper Thickness: 1/1/1/1/1/1 OZ

5 Min Lind Space&Width: 3.5/3.5 mil

6 Application Area: Amplifier

 

 

 


Material Data Sheet:

 

S1000-2
Items Method Condition Unit Typical Value
Tg IPC-TM-650 2.4.25 DSC 180
IPC-TM-650 2.4.24.4 DMA 185
Td IPC-TM-650 2.4.24.6 5% wt. loss 345
CTE (Z-axis) IPC-TM-650 2.4.24 Before Tg ppm/℃ 45
After Tg ppm/℃ 220
50-260℃ % 2.8
T260 IPC-TM-650 2.4.24.1 TMA min 60
T288 IPC-TM-650 2.4.24.1 TMA min 20
T300 IPC-TM-650 2.4.24.1 TMA min 5
Thermal Stress IPC-TM-650 2.4.13.1 288℃, solder dip -- 100S No Delamination
Volume Resistivity IPC-TM-650 2.5.17.1 After moisture resistance MΩ.cm 2.2 x 108
E-24/125 MΩ.cm 4.5 x 106
Surface Resistivity IPC-TM-650 2.5.17.1 After moisture resistance 7.9 x 107
E-24/125 1.7 x 106
Arc Resistance IPC-TM-650 2.5.1 D-48/50+D-4/23 s 100
Dielectric Breakdown IPC-TM-650 2.5.6 D-48/50+D-4/23 kV 63
Dissipation Constant (Dk) IPC-TM-650 2.5.5.9 1MHz -- 4.8
IEC 61189-2-721 10GHz --
Dissipation Factor (Df) IPC-TM-650 2.5.5.9 1MHz -- 0.013
IEC 61189-2-721 10GHz --
Peel Strength (1Oz HTE copper foil) IPC-TM-650 2.4.8 A N/mm
After thermal Stress 288℃,10s N/mm 1.38
125℃ N/mm 1.07
Flexural Strength LW IPC-TM-650 2.4.4 A MPa 562
CW IPC-TM-650 2.4.4 A MPa 518
Water Absorption IPC-TM-650 2.6.2.1 E-1/105+D-24/23 % 0.1
CTI IEC60112 A Rating PLC 3
Flammability UL94 C-48/23/50 Rating V-0
E-24/125 Rating V-0

 

 

 

FAQ:

 

Q1: What are PCB Mouse bites?

A1: 

Red Solder Mask FR4 Circuit Board 1 OZ Copper Thickness OSP Treatment 0

Mouse bites also known as perforated breakaway tabs in a PCB are small perforations / pricks on the board which allow for panelizing and depanelizing smaller groups of PCBs together. This way multiple PCB boards can be assembled together, thereby saving time and making the process cost-effective. The assembled PCBs can be separated by applying pressure on the sections of the board that have perforations. Once separated, i.e after the depanelization process, the board looks like it has mouse bites in these sections.

Below is an Image of PCBs assembled to each other with the help of mouse bites.

Red Solder Mask FR4 Circuit Board 1 OZ Copper Thickness OSP Treatment 1

Below is an Image of a PCB being depaneled easily which is also made possible due to mouse bites. You can also see the sharp edges after the boards have been separated, these are called mouse bites.

Red Solder Mask FR4 Circuit Board 1 OZ Copper Thickness OSP Treatment 2

When multiple PCBs are connected using mouse bites they have a smooth finish. When compared to PCB boards connected using V-Scoring, boards connected with mouse bites are easier to depanelize i.e they require less force.

Precautions to take before inserting Mouse bites on a PCB

  • Develop an adequate number of mouse bites to support a board completely when paneled with other boards
  • Do not place the mouse bites close to sensitive component areas or circuitry. This will cause the board to experience breakout stress which can damage sensitive components or sections of the board
  • The spacing between two mouse bites must range between 60mm to 90mm

 

 

 

 

Contact Details
admin

Phone Number : +8613826589739

WhatsApp : +008613826589739