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FR4 Substrate Material Double Layer PCB Blue Solder Mask Ink

Basic Information
Place of Origin: China
Brand Name: WITGAIN PCB
Certification: UL
Model Number: PCB000268
Minimum Order Quantity: 1 pcs/lot
Price: negotiable
Packaging Details: Vacuum bubble bag packaging
Delivery Time: 10 days
Payment Terms: T/T
Supply Ability: 100k pcs/month
Detail Information
Place Of Origin: Guangdong China Material: FR4 TG>130
No Of Layers: 2 Layer Solder Mask Colour: Blue Solder Mask
Surface Technics: Immersion Gold 1U' Min Line Space&Width: 6/6mil
High Light:

FR4 Substrate Material Double Layer PCB

,

FR4 TG150 Double Layer PCB

,

MSDS 2 Layer PCB


Product Description

Double Layer FR4 Substrate Material PCB Blue Solder Mask Ink

 

 

  • Main Features:

 

1 2 Layer FR4 substrate material printed circuit board.

2 ROHS, MSDS, SGS, UL, ISO9001&ISO14001 Certificated.

3 FR4 TG150 material, pcb thickness is 1.6mm.

4 Blue solder mask and white silkscreen.

5 35um copper on each layer.

6 Quality Acceptance Standards: IPC 6012E Class2

7 Surface treatment is immersion gold 1u'.

8 Customized pcb, need customer to send us the gerber file or pcb file.

 

 

  • S1150G Material Data Sheet:

 

S1150G
Items Method Condition Unit Typical Value
Tg IPC-TM-650 2.4.25 DSC 155
Td IPC-TM-650 2.4.24.6 5% wt. loss 380
CTE (Z-axis) IPC-TM-650 2.4.24 Before Tg ppm/℃ 36
After Tg ppm/℃ 220
50-260℃ % 2.8
T260 IPC-TM-650 2.4.24.1 TMA min >60
T288 IPC-TM-650 2.4.24.1 TMA min 30
Thermal Stress IPC-TM-650 2.4.13.1 288℃, solder dip -- pass
Volume Resistivity IPC-TM-650 2.5.17.1 After moisture resistance MΩ.cm 6.4 x 107
E-24/125 MΩ.cm 5.3 x 106
Surface Resistivity IPC-TM-650 2.5.17.1 After moisture resistance 4.8 x 107
E-24/125 2.8 x 106
Arc Resistance IPC-TM-650 2.5.1 D-48/50+D-4/23 s 140
Dielectric Breakdown IPC-TM-650 2.5.6 D-48/50+D-4/23 kV 45+kV NB
Dissipation Constant (Dk) IPC-TM-650 2.5.5.9 1MHz -- 4.8
IEC 61189-2-721 10GHz --
Dissipation Factor (Df) IPC-TM-650 2.5.5.9 1MHz -- 0.01
IEC 61189-2-721 10GHz --
Peel Strength (1Oz HTE copper foil) IPC-TM-650 2.4.8 A N/mm
After thermal Stress 288℃,10s N/mm 1.4
125℃ N/mm 1.3
Flexural Strength LW IPC-TM-650 2.4.4 A MPa 600
CW IPC-TM-650 2.4.4 A MPa 450
Water Absorption IPC-TM-650 2.6.2.1 E-1/105+D-24/23 % 0.1
CTI IEC60112 A Rating PLC 0
Flammability UL94 C-48/23/50 Rating V-0
E-24/125 Rating V-0

 

 

  • FAQ:

 

Q1: What is a PCB Trace?

A1: 

FR4 Substrate Material Double Layer PCB Blue Solder Mask Ink 0

A PCB trace is a highly conductive track that is used to connect components on a Printed Circuit Board to each other. Since a PCB Trace is used to conduct electricity it has to be made of a material that is highly conductive and stable. Additionally, the physical properties like its width and thickness help determine the amount of current that can pass through managing thermal stability. The most popular material for making trace is Copper. PCB traces are a fundamental building block a PCB without which it would not be able to function. A Properly designed PCB trace is of absolute importance as it will determine the proper functioning of PCBs used in electronic devices.

 

There are a number of parameters that must be considered when designing PCB traces. The primary parameters that need to be considered are as follows:

  • Trace width
  • Trace thickness
  • Trace resistance
  • Trace current

Trace Width & Thickness:

 

The trace width and thickness are important design parameters for a PCB. These parameters determine the amount of current that can pass through the trace without overheating and damaging the board. The ability of the PCB to handle high levels of power requires a trace with high cross-sectional area.

 

The thickness of a trace in a PCB board is essential for a designer during the design process of a printed circuit board. It must be consistent throughout the PCB i.e the default thickness for PCBs can be between 1oz (35 microns) to 2oz (70 microns). Due to the variety of PCB boards (single-sided, double-sided, and multi-layered) available in the market, the trace thickness varies with the board type.

 

If these parameters are ignored the PCB board might not function as intended and result in damage or sparks which will harm the components connected to the board.

 

Trace Resistance

 

PCB Trace resistance is another design parameter that needs to be considered while designing a PCB. The PCB trace resistance is helpful in determining the loss in signal transfer though a PCB and how much power can be dissipated by the trace. If not factored correctly, this can lead to various design and implementation issues.

The Formula to calculate trace resistance is as follows:

FR4 Substrate Material Double Layer PCB Blue Solder Mask Ink 1

Here L, W, and T represent the physical area of the trace, i.e., length, width, and height and α represents the temperature coefficient of the copper. The calculations can only determine an approximate value.

 

The primary issue of trace resistance is power loss. It will eventually lead to a temperature rise and a reduction in conductivity. The most efficient way to tackle power loss due to trace resistance is to increase the trace area (width & thickness) for which knowing the trace resistance is absolutely essential.

 

Trace Current

 

The current capacity of a PCB trace is the maximum current that can run through the trace without causing harm to any of the electronic components present on the board. The trace current of a PCB depends upon the trace width and thickness.

 

 

Contact Details
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