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1.6MM Board Thickness 4 Layer Printed Circuit Board Black Solder Mask Ink

Basic Information
Place of Origin: China
Brand Name: WITGAIN PCB
Certification: UL
Model Number: PCB00359
Minimum Order Quantity: 1 pcs/lot
Price: negotiable
Packaging Details: Vacuum bubble bag packaging
Delivery Time: 20 days
Payment Terms: T/T
Supply Ability: 100k pcs/month
Detail Information
No Of Layers: 4 Layer Material: FR4 TG>150
Solder Mask Colour: Black Solder Mask PCB Thickness: 1.6 MM
BGA Size: 8.8 Mil Min Lind Space&Width: 3.5/3.5 Mil
High Light:

1.6MM 4 Layer Printed Circuit Board

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8.8mil 4 Layer Printed Circuit Board

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4 Layer PCB UL


Product Description

4 Layer PCB 1.6 MM Board Thickness Black Solder Mask Ink
 

  • Main Features:

 
1 4 Layer Printed Circuit Board PCB .
2  Immersion Gold treatment, gold thickness 1u'.
3 FR4 substrate material, tg150 degree.
4 Min line space and width 3.5/3.5mil.
5 Copper thickness is 1 oz on each layer, 35 um on each layer.
6  Black solder mask and white silkscreen.
7  ROHS, MSDS, SGS, UL, ISO9001&ISO14001 Certificated

8  Application product: Cameras
 
 

  • S1150G Material Data Sheet:
S1150G
Items Method Condition Unit Typical Value
Tg IPC-TM-650 2.4.25 DSC 155
Td IPC-TM-650 2.4.24.6 5% wt. loss 380
CTE (Z-axis) IPC-TM-650 2.4.24 Before Tg ppm/℃ 36
After Tg ppm/℃ 220
50-260℃ % 2.8
T260 IPC-TM-650 2.4.24.1 TMA min >60
T288 IPC-TM-650 2.4.24.1 TMA min 30
Thermal Stress IPC-TM-650 2.4.13.1 288℃, solder dip -- pass
Volume Resistivity IPC-TM-650 2.5.17.1 After moisture resistance MΩ.cm 6.4 x 107
E-24/125 MΩ.cm 5.3 x 106
Surface Resistivity IPC-TM-650 2.5.17.1 After moisture resistance 4.8 x 107
E-24/125 2.8 x 106
Arc Resistance IPC-TM-650 2.5.1 D-48/50+D-4/23 s 140
Dielectric Breakdown IPC-TM-650 2.5.6 D-48/50+D-4/23 kV 45+kV NB
Dissipation Constant (Dk) IPC-TM-650 2.5.5.9 1MHz -- 4.8
IEC 61189-2-721 10GHz --
Dissipation Factor (Df) IPC-TM-650 2.5.5.9 1MHz -- 0.01
IEC 61189-2-721 10GHz --
Peel Strength (1Oz HTE copper foil) IPC-TM-650 2.4.8 A N/mm
After thermal Stress 288℃,10s N/mm 1.4
125℃ N/mm 1.3
Flexural Strength LW IPC-TM-650 2.4.4 A MPa 600
CW IPC-TM-650 2.4.4 A MPa 450
Water Absorption IPC-TM-650 2.6.2.1 E-1/105+D-24/23 % 0.1
CTI IEC60112 A Rating PLC 0
Flammability UL94 C-48/23/50 Rating V-0
E-24/125 Rating V-0

 

 

  • FAQ:

 
Q1: What are Copper Clad Laminates?
A1: A copper clad laminate is a laminate that has copper foil as its conducting layer. Laminates form the core of a PCB. It consists of layers of metal foil and prepreg (resin + reinforcement material) laminated together with heat and pressure. A laminate used for Printed Circuit Boards can have many different types of metal foil as its conducting layer. These include copper, aluminum, uranium, gold, palladium, carbon fiber, graphite etc. However, copper is used the most due to its excellent electrical characteristics and low cost.

 

Copper Clad Laminates are classified based on the copper weight, type of resin used, Reinforcement type, glass transition temperature, and various thermal and electrical properties.

 

The copper foil which is used as the conducting layer of the laminate is available in different specifications as laid out in IPC-4101. This standard also specifies the reinforcement type, the resin system the glass transition temperature range and flammability requirements for making quality copper clad laminate.

 

Copper Weight: Copper Weight or Copper Thickness in a Printed Circuit Board represents the thickness of 1 ounce of copper rolled out over an area of 1 square foot. It determines the current carrying capacity of a PCB. This is an important parameter that needs to be specified when selecting a copper clad laminate.

 

Resin: The type of resin used determines the mechanical properties related to stress and strain bearing capacity of the laminate and the thermal characteristics like the rate of expansion and curing properties, which again determine its rate of cross linking among molecular chains which determine its decomposition and glass transition temperature.

 

Phenolic Epoxy Polyester
PTFE Polyamide/Epoxy Epoxy/Multi Functional Epoxy
Bismaleimide Triazine(BT) Polyamide Polyimide Cyanate Ester
Cyanate Ester Epoxy/Phenolic Flame Resistant

 

 

Reinforcement: The choice of reinforcement used while manufacturing the laminate determines its tooling and drilling characteristics. Cotton and cellulose based laminates do not need to be drilled and can be punched to make a hole in it. Laminates made from a fiber of any kind like, glass, mat glass and quartz require special drilling practices, like closely monitoring the rate of wear of drill bit, the pressure applied to the drill bit and the spindle speed. This is because the thickness and granularity of the glass fibers, the thickness of the copper foil have a huge impact on the number of times a drill bit can be used, which ultimately has an impact on the final cost of making the laminate.

 

Cotton Paper Woven Glass Mat Glass
Cotton Paper/Woven Glass Woven Glass/Mat Glass Mat Glass/ Glass Veil
Woven Aramid Woven Quartz Fiber Woven E-Glass Surface/Cellulose Paper Core

 

 

A copper clad laminate is basically a combination of these layers. The combination determines various mechanical, physical, thermal and electrical properties of the laminate. The properties include the Glass Transition Temperature, the coefficient of thermal expansion. Electrical properties of the board include Dielectric Constant, loss tangent, insulation Resistance, surface resistivity and various other parameters.


 
 
 
 

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