Via In Pad Treatment 8 Layer PCB Black Solder Mask FR4 TG170

Basic Information
Place of Origin: China
Certification: UL
Model Number: PCB000332
Minimum Order Quantity: 1 pcs/lot
Price: negotiable
Packaging Details: Vacuum bubble bag packaging
Delivery Time: 20 days
Payment Terms: T/T
Supply Ability: 100k pcs/month
Detail Information
Layer Count: 8 Layer Material: FR4 TG 170
PCB Thickness: 1.6 MM Solder Mask Colour:: Black Solder Mask
BGA Size: 8 Mil Min Trace: 3/3 Mil
High Light:

1.6MM 8 Layer PCB


8mil 8 Layer PCB


FR4 TG170 8 Layer PCB

Product Description

8 Layer Via In Pad Treatment PCB Black Solder Mask




Main Features:


1 8 Layer Printed Circuit Board with very high relability.

2 PCB drawing size is 142mm*96mm/1pcs

3 Copper thickness is 35 um on each layer

4 FR4 substrate material ,halogen free material.

5 Surface treatment is immersion gold. 

6 Gold thickness is 1U'.

7 Finished board thickness is 1.6mm.

8 Gerber file or PCB file should be offered by customer before production.



Our Equipment List:


NO Equipment Name Equipment Brand Equipment QTY
1 Automatic Cutting SCHCLLING-CA6858 1
2 Roll Cutting QIXIAN 2
3 Vertical Cutting SHANGYUE 2
4 Innerlayer pretreatment JIECHI 4
5 Automatic coat&wiring QUNYU 4
6 Automatic exposure CHUANBAO 11
7 Large table exposure HECHUAN 2
8 Laser Plotter ORBOTEC 3
9 Etching line KB 4
10 PE Punching PE-3000 1
12 Double row brown KB 3
13 PP Cutting ZHENGYE 5
14 PP Chopping ZHONGDA 2
15 Hot-melt machine HANSONG 6
16 Riveting machine JIAOSHI 6
17 X-Ray Check HAOSHUO 5
18 Automatic reflux LANDE 2
19 Steel plate washer FENGKAI 2
20 Large size press DATIAN 8热4冷
21 X-Ray Drilling target HAOSHUO 8
22 Ccd Drilling target XUELONG 10
23 Automatic grinding XINHAO 5
24 Plate thickness Measuring AISIDA 2
25 Four axis gongs machine DALIANG 2
26 Two axis gongs machine BIAOTEFU 4
27 Automatic grinding mill JIEHUI 2
28 Drilling machine TONGTAI 13
29 Hole testing machine YAYA 1
30 Sinking rough mill KB 1
31 Vertical copper wire YAMEI 1
32 Automatic electroplating line JINMING 1
33 Dryer after electroplating KB 1
34 Etch machine KB 1
35 Film checking machine YUBOLIN 2
36 Line pre-processing KB 2
37 Automatic laminator ZHISHENG 3
38 Outer exposure machine CHUANBAO 8
39 Outer exposure machine HECHUAN 3
40 Etch machine JULONG 1
41 Line developing machine KB 1
42 Sand blasting machine KB 1
43 Precoarsening pretreatment KB 2
44 Electrostatic spraying line FURNACE 1
45 Automatic screen printing machine HENGDAYOUCHUANG 12
46 Pre baked tunnel furnace KB 1
47 Solder resist exposure machine CHUANBAO 6
48 Solder resist exposure machine HECHUAN 2
49 Post baked tunnel furnace GC0-77BD 2
50 Solder resist developing machine KB 1
51 Screen printing machine 1.8mm/2.0mm 4
52 Character baking tunnel furnace GC0-77BD 1
53 Sunk Tin spray line   2
54 Nickel palladium and gold wire XINHUAMEI 1
55 Alternator   2
56 OSP line KB 1
57 Gongs machine YIHUI 20
60 Hydraulic punch press SRT 2
61 Test machine MASON 17
62 High speed flying needle tester WEIZHENGTAI 3
63 Four wire flying needle tester XIELI 2
64 Product washing machine KB 2
65 Plate warping machine XINLONGHUI 2
66 Vacuum packaging machine SHENGYOU 4






Q1:What is Via plugging? When is it used? How is it different from Via Tenting?


A1: Via plugging is a process in which vias are completely filled with resin or closed with a solder mask. This technique is different from via tenting where resin/solder mask doesn’t fill the via hole but just provides a covering.

Via In Pad Treatment 8 Layer PCB Black Solder Mask FR4 TG170 0

Via In Pad Treatment 8 Layer PCB Black Solder Mask FR4 TG170 1

Via plugging is done as a preventive measure to secure the vias from the unwanted flow of solder material during the assembly/soldering process. During the soldering process, if a via is not plugged or tented, the solder can flow down the via from the pads and can create unnecessary solder joints.


Via plugging can be done using conductive or non-conductive materials. The conductively filled vias help to carry a large amount of current from one side of the PCB board to another. However, the main drawback of conductively filled vias is the difference in CTE (Coefficient of Thermal Expansion) between the conductive fill and surrounding laminate. During PCB operation, the conductive material will heat and expand at a faster rate than the surrounding laminate, which can cause a fracture between the via wall and associated contact pad.


The via holes filled with non-conductive materials will still function like normal vias. However, they will not be able to carry higher current loads like those filled with conductive materials.



Contact Details

Phone Number : +8613826589739

WhatsApp : +8613826589739