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Selective 6 Layer HDI Immersion Gold PCB With Blind / Buried Holes

Basic Information
Place of Origin: China
Brand Name: WITGAIN PCB
Certification: UL
Model Number: HDIPCB0012
Minimum Order Quantity: 1pcs/lot
Price: negotiable
Packaging Details: vacuum package in bubble wrap
Delivery Time: 25 days
Payment Terms: T/T
Supply Ability: 100kpcs/Month
Detail Information
Layer Count: 6 Layer PCB Kind: HDI PCB
Board Thickness: 1.2 MM Min Hole: 0.1MM
Solder Mask: Green Solder Mask Surface Treatment: Selective Immersion Gold
Material: S1000-2 BGA Size: 9 MIL
High Light:

Green Solder Mask HDI PCB

,

6 Layer Immersion Gold PCB

,

Blind Holes HDI PCB


Product Description

Selective Immersion Gold 6 Layer HDI PCB With Blind Holes And Buried Holes

 

 

PCB Specifications:  

 

1 Part NO: HDIPCB0011

2 Layer Count: 6 Layer HDI PCB

3 Finished Board Thickness: 1.2MM

4 Drilling: L1-L2 0.1MM, L2-L5 0.2MM, L5-L6 0.1MM, L1-L6 0.2MM 

5 Min Lind Space&Width: 2.9/2.8mil

6 Copper Thickness: 1/H/H/H/H1

7 Application Area: Smart Watch

8 PCB Size: 136MM*101.5MM/9PCS

 

 

 

Our production applications:

 

1 Consumer electronic products: SSD, TWS earphones, headsets,computer devices, portable power supplies, bluetooth modules, gps modules, wifi modules, smart keys for cars, intelligent locks, floor mopping robots, zigbee, etc.

2 Industrial control:main boards in machines, industrial robots, servo motors etc.

3 Automotive: BMS main boards, automotive radar etc.

4 Power supplies: UPS, industrial power supply, frequency power supply.

5 Medical: medical equipment, medical equipment power supply.

6 Communication products: 5G base station, routers, satellites, antennas.

7 Photovoltaic inverter

 

 


IT180A DATA SHEET:

 

Items IPC TM-650 Typical Value Unit
Peel Strength, minimum
A. Low profile copper foil
B. Standard profile copper foil
2.4.8 5
8
lb/inch
Volume Resistivity 2.5.17.1 1x109 M-cm
Surface Resistivity 2.5.17.1 1x108 M
Moisture Absorption, maximum 2.6.2.1 0.10 %
Permittivity (Dk, 50% resin content)
A. 1MHz
B. 1GHz
2.5.5.9
2.5.5.9
4.5
4.4
--
Loss Tangent (Df, 50% resin content)
A. 1MHz
B. 1GHz
2.5.5.9
2.5.5.9
0.014
0.015
--
Flexural Strength, minimum
A. Length direction
B. Cross direction
2.4.4 500-530
410-440
N/mm2
Thermal Stress 10 s at 288°C
A. Unetched
B. Etched
2.4.13.1 Pass Pass Rating
Flammability UL94 V-0 Rating
Comparative Tracking Index (CTI) IEC 60112 / UL 746 CTI 3 (175-249) Class (Volts)
Glass Transition Temperature(DSC) 2.4.25 175 ˚C
Decomposition Temperature 2.4.24.6 345 ˚C
X/Y Axis CTE (40to 125) 2.4.41 11-13 / 13-15 ppm/˚C
Z-Axis CTE
A. Alpha 1
B. Alpha 2
C. 50 to 260 Degrees C
2.4.24 45
210
2.7
ppm/˚C ppm/˚C
%
Thermal Resistance
A. T260
B. T288
2.4.24.1 >60
20
Minutes Minutes

 

 

 

Q1: What is the Comparative Tracking Index (CTI) or Proof Tracking Index (PTI) of the PCB base material?

A1:

4 Layer Half Plated Hole PCB Bluetooth Module 0.8MM Board Thickness Cusomized 0

 

Comparative Tracking Index (CTI) is the extent to which the insulating material of the PCB can resist the unwanted current to flow between traces on the board. It is a measure of the ability of the PCB substrate to withstand any breakdown between two tracks on the PCB surface. It is used to assess the proportionate resistance of the PCB base material and helps calculate the high-voltage isolation values between the tracks. The CTI / PTI value indicates how resistant the PCB material is against environmental influences such as dirt and moisture. The higher the value, the more resistant the material is. The default CTI value for FR4 is 175 and goes up to 600 on special materials. The CTI / PTI value is determined using standard test methods.

 

Tracking resistance is the resistance offered by the PCB trace against the current flow. The higher the number of components placed on the PCB board the higher is its overall packing density, this leads to smaller trace spacings. Therefore, the CTI / PTI value in the PCB base material is of prime importance. These values help to deduce the overall PCB tracking resistance.

 

These values give an estimation for leakage or short-circuit as trace spacing becomes small due to the increased number of components. As per the IEC standard, the smaller CTI grade substrate offers good resistance to the electrical breakdown. CTI is a critical number while selecting a PCB material. Normal FR-4 ranges from 175 to 225V. IEC has prescribed three of the following classes for PCB CTI calculation:

 

 

Comparative Tracking Index (CTI) in Volts Class
600 <= CTI I
400 <= CTI < 600 II
175 <= CTI < 400 IIIA
100 <= CTI < 175 IIIB

 

 

Understanding CTI with respect to PCB routing:

 

When two PCB traces run in parallel, the dielectric material should not breakdown at any time and both traces should be able to carry current without any problem. The chance of dielectric breaking down and the traces having a direct short is very less. The dielectric ensures that resistance is present between the two traces. One of the primary reasons why the two traces might have leakage current is due to the impurities forming between traces, environmental conditions, voltage applied, and temperature..

 

CTI is the measurement of the susceptibility of the PCB’s insulating material to the electrical breakdown. Mathematically, CTI is that voltage, which results in failure by breakdown after 50 drops of 0.1 percent ammonium chloride solution have fallen on the material.

 

Creepage Distance and CTI Value:

 

Creepage distance is the shortest path available between two PCB conductors measured along the surface of the insulation. Depending upon the CTI value of the PCB base material, the creepage value will differ. If the CTI value is higher, then the minimum creepage value is required. In short, high a CTI value indicates closeness between the PCB conductors.

 

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