|Layer Count:||8 Layer||Material:||FR4 TG150|
|Board Thickness:||0.9 MM||Surface Treatment:||ENIG 1.5U'|
|Drawing Size:||20MM*80MM||Min Hole:||0.2MM|
128GB SSD Circuit Board,
FR4 TG150 SSD Circuit Board,
PCIE 128GB 8 Layer SSD Circuit Board FR4 TG150 With 0.2mm Min Hole
SSD NVME 2280 PCIE 128GB 8 Layer Printed Circuit Board
Part NO: SSDPCB00012
Layer Count: 8 Layer Printed Circuit Board
Finished Board Thickness: 0.9mm +/-0.05mm
Copper Thickness: 1/H/H/H/H//H/H1
Min Lind Space&Width: 3/3mil
Application Area: SSD(Solid State Drive)
Our Product Categories:
1 FR4 substrate PCB : 2 Layer Printed Circuit Board, 4 Layer PCB, 6 Layer PCB, 8 Layer PCB, 10 Layer PCB, 12 Layer PCB, 14 Layer PCB, 16 Layer PCB, 18 Layer PCB, 20 Layer PCB, 22 Layer PCB, 24 Layer PCB, HDI PCB, High frequency PCB.
2 Aluminum Substrate pcb: 1 Layer Aluminum PCB, 2 Layer Aluminum PCB, 4 Layer Aluminum PCB.
3 Flexible PCB: 1 Layer FPC, 2 Layer FPC, 4 Layer FPC, 6 Layer FPC
4 Rigid-Flex PCB: 2 Layer Rigid-Flex PCB, 4 Layer Rigid-Flex PCB, 6 Layer Rigid-Flex pcb, 8 Layer Rigid-Flex PCB, 10 Layer Rigid-Flex pcb
5 Ceramic substrate pcb: single Layer Ceramic pcb, 2 layer ceramic pcb
Q:What is SMT Rework Station?
SMT Rework Station is a workspace system that is used to perform repairing, refinishing and modification tasks on printed circuit boards that have surface-mounted components and Ball Grid Array (BGA) packaging. Circuit boards with column grid array packaging, chip scale packaging, quad flat packaging, land grid arrays, and other surface-mounted devices can also be modified by these rework stations. SMT Rework Stations are also known as SMD Rework Stations or BGA Rework Stations. SMT rework stations are widely used in low-volume and short-run production operations.
SMT Rework Stations are available in a wide variety of features like split-vision cameras and automated tools but generally, there are two types of SMT Rework Stations.
Hot Air Rework Stations
In these stations, hot air is used to heat the PCB's parts. Hot air is moved and directed by various nozzles to ensure that heat is dispersed uniformly. When working on delicate and small components, technicians can quickly accomplish tasks by moving these nozzles to direct the air.
Hot Air Rework Stations generate more noise and are older than IR rework technology, so more technicians are trained to use hot air stations than IR rework stations.
IR Rework Stations
The IR rework stations heat PCB components using fixed ceramic heaters and infrared rays rather than hot air. The IR SMT rework station runs in complete silence. There are also fewer moving parts, which might make maintenance simpler.
The fundamental working principle of the BGA rework station is that a single SMT or BGA is heated from above and below and is subjected to a similar temperature/time profile during rework as it does during reflow in the initial production process.
A complete "reflow" process is applied to the SMT component during the SMT rework operation. The rework station typically employs a software-controlled multi-stage reflow process, as advised by board and component manufacturers, where all parameters, such as temperature levels and ramp rates, are precisely controlled.
SMT rework stations have a variety of applications. One of the most frequent causes of rework is upgrades. A PCB might require parts to be replaced or upgraded by technicians. PCBs may contain a variety of faulty parts that may need to be reworked. Pads may be harmed during BGA removal, some components may be heat-damaged, or there may be excessive solder joint voiding. Errors can happen during the rework process. For instance, the PCB might have a poorly developed thermal profile for BGA rework or incorrect SMT orientation. If so, additional rework on the PCB will probably be required to fix the faulty assembly.
Though the initial investment in SMT Rework Stations is significant they offer several advantages: