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4 Layer ENIG Printed Circuit Boards With Different Silkscreen Color

Basic Information
Place of Origin: China
Certification: UL
Model Number: SSDPCB00013
Minimum Order Quantity: 1pcs/lot
Price: negotiable
Packaging Details: Vacuum package in bubble wrap
Delivery Time: 15 working days
Payment Terms: T/T
Supply Ability: 1kkpcs/month
Detail Information
Layer Count: 4 Layer TG Degree: 170
Solder Mask Color: Top Green,bottom White Silkscreen Color: Top White, Bottom Black
Surface Treatment: ENIG Copper Thickness: 2/1/1/2oz
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ENIG Printed Circuit Boards


2oz Printed Circuit Boards


1oz ENIG 4 Layer Circuit Board

Product Description

4 Layer ENIG Printed Circuit Boards With Different Silkscreen Color


4 layer ENIG Printed Circuit Board with different solder mask color and different silkscreen color on both sides

PCB Specifications: 
Part NO: PCB5266A0
Layer Count: 4 Layer Printed Circuit Board
Finished Board Thickness: 1.6mm
Copper Thickness: 2/1/1/2oz
Material: FR4,tg170
Board size: 258.7*139.05
Special Feature: two different solder mask and silkscreen color on both sides
Surface Treatment: ENIG
Our Product Categories:
1. FR4 substrate PCB : 2 Layer Printed Circuit Board, 4 Layer PCB, 6 Layer PCB, 8 Layer PCB, 10 Layer PCB, 12 Layer PCB, 14 Layer PCB, 16 Layer PCB, 18 Layer PCB, 20 Layer PCB, 22 Layer PCB, 24 Layer PCB, HDI PCB, High frequency PCB.
2.  Aluminum Substrate pcb: 1 Layer Aluminum PCB, 2 Layer Aluminum PCB, 4 Layer Aluminum PCB.
3. Flexible PCB: 1 Layer FPC, 2 Layer FPC, 4 Layer FPC, 6 Layer FPC
4. Rigid-Flex PCB: 2 Layer Rigid-Flex PCB, 4 Layer Rigid-Flex PCB, 6 Layer Rigid-Flex pcb, 8 Layer Rigid-Flex PCB, 10 Layer Rigid-Flex pcb
5. Ceramic substrate pcb: single Layer Ceramic pcb, 2 layer ceramic pcb
Q:What is a HDI PCB Board?

4 Layer ENIG Printed Circuit Boards With Different Silkscreen Color 0

HDI stands for ‘High Density Interconnects’. An HDI PCB is a dense version of a printed circuit board where the components are placed closer to each other allowing the overall board size to be smaller. HDI printed circuit boards use optimized routing, smaller components, BGA component footprints and optimized vias to make connections between the components on the board.

In regular PCBs we use through hole vias to connect multiple layers of the board to each other. A traditional via goes from the top of the PCB to the bottom, connecting all the layers, as seen in the image below. These vias are easy to deploy as they can be drilled through the board from top to bottom using a regular drill. The main disadvantage of regular vias from a space optimization point of view is that this via will connect all the layers of the board, even those that do not need to be connected to each other and thus can result in wastage of space within some layers of the PCB.

An HDI PCB uses different types of vias – microvias, buried vias and blind vias to optimize the space requires for interconnections between the layers and components.

4 Layer ENIG Printed Circuit Boards With Different Silkscreen Color 1

Microvias are ultra-small vias which can be drilled using lasers. They are much smaller in diameter than regular vias.

A Blind via connects the outer layer to an inner layer, with access to only one external layer.

A Buried via can connect inner layers of the same substrate or multiple substrates, with no access to external layers as seen below.

Blind or buried via gives access to only functionally required layers, and as a result do not occupy space on all the layers at a given time. This provides more space for components with enhanced routing within the traces. A designer can mount more components to increase the board density or can reduce the board size as per the requirement.


Advantages of an HDI PCB Board:


HDI PCBs allow for increased component placements on both sides of the PCB thereby making the board smaller and lighter

HDI PCBs can reduce the amount of laminate material required. This can result in lower pricing of a board when using a very expensive laminate material

HDI boards can improve signal transmission along with a reduction in signal loss and delays as connection paths are shorter

Provides better heat dissipation

Contact Details

Phone Number : +8613826589739

WhatsApp : +8613826589739