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HDI circuit board FR4 TG170 substrate ENIG 2u' 10 Layer PCB

Basic Information
Place of Origin: China
Certification: UL
Model Number: S08E5551A0
Minimum Order Quantity: 1pcs/lot
Price: negotiable
Packaging Details: Vacuum package in bubble wrap
Delivery Time: 15 working days
Payment Terms: T/T
Supply Ability: 1kkpcs/month
Detail Information
Layer Count: 10 Layer Material: FR4 TG170
Board Thickness: 1.8mm Surface Treatment: ENIG 2U'
Solder Mask Color: Green Board Size: 154*143
15.Special Feature: HDI Circuit Board

Product Description

HDI circuit board FR4 TG170 substrate ENIG 2u' 10 Layer PCB


PCB Specifications: 


Part NO: S10E5012A0

Layers: 10Layer

Surface Finished: Immersion gold 2u'

Material: FR4

Thickness: 1.8mm

PCB Size: 154mm*143mm

Finished copper: 1OZ

Solder Mask colour: Green

Silkscreen colour: White

Blind hole size: 0.127mm (1-2/9-10)

Buried hole size:0.127mm (2-3/2-9/8-9)

Though hole size: 0.3mm (1-10)

No. of PP: 8pcs PP
Certificates: UL/94V-0/ISO



Our Product Categories:


Our Product Categories
Material Kinds Layer Counts Treatments
FR4 Single Layer HASL Lead Free
CEM-1 2 Layer/Double Layer OSP
CEM-3 4 Layer Immersion Gold/ENIG
Aluminum Substrate 6 Layer Hard Gold Plating
Iron Substrate 8 Layer Immersion Silver
PTFE 10 Layer Immersion Tin
PI Polymide 12 Layer Gold fingers
AL2O3 Ceramic Substrate 14 Layer Heavy copper up to 8OZ
Rogers, Isola high frequency materials 16 Layer Half plating holes
Halogen free 18 Layer HDI Laser drilling
Copper based 20 Layer Selective immersion gold
  22 Layer immersion gold +OSP
  24 Layer Resin filled in vias





Q:what is HDI PCB?


  • Definition of a High-Density Interconnect (HDI) Printed Circuit Board

High-density interconnect, or HDI, circuit boards are printed circuit boards with a higher wiring density per unit area than traditional printed circuit boards. In general, HDI PCBs are defined as PCBs with one or all of the following: microvias; blind and buried vias; built-up laminations and high signal performance considerations. Printed circuit board technology has been evolving with changing technology that calls for smaller and faster products. HDI boards are more compact and have smaller vias, pads, copper traces and spaces. As a result, HDIs have denser wiring resulting in lighter weight, more compact, lower layer count PCBs. Rather than using a few PCBs in a device, one HDI board can house the functionality of the previous boards used.

  • Benefits of HDI Printed Circuit Boards

The primary benefit of HDI printed circuit boards is the capability to “do more with less”; with copper-etching technology continuously refined for better precision, it became possible to combine functionalities of multiple PCBs into one HDI PCB.

Shortening the distance between devices and trace spaces, HDI PCBs allow for deployment of a large number of transistors for better performance in electronics while lowering power consumption. Signal integrity is also improved due to the shorter distance connections and lower power requirements. Other performance improvements over conventional PCBs include stable voltage rail, minimal stubs, lower RFI/EMI, and closer ground planes and distributed capacitance.

Additionally, consider using a HDI printed circuit board for the following benefits:

  • Cost-effectiveness: when properly planned out, overall costs are reduced due to the lower number of necessary layers and smaller sizes/fewer number of needed boards when compared to standard PCBs.
  • Faster time-to-market: Design efficiencies in HDI PCB production mean faster time-to-market. Because of the easy placement of components and vias and electrical performance, it takes a shorter amount of time to go through the design and testing process for HDI PCBs.
  • Better reliability: Microvias have much better reliability than typical through holes due to the use of a smaller aspect ratio; they are more dependable than through holes, granting HDIs outstanding performance with better materials and parts.
  • High-Density Interconnect Printed Circuit Board Structures

Depending on the design requirements, HDI Printed Circuit Boards can utilize different layering methods to achieve the desired performance.


HDI PCB (1+N+1): Simplest HDI
  • This structure of HDI PCB contains 1 “build-up” of high-density interconnection layers, suitable for BGA with lower I/O counts.
  • It has fine lines, microvia and registration technologies capable of 0.4 mm ball pitch, excellent mounting stability and reliability, and may contain copper filled via.
  • Applications: Cell phone, MP3 Player, GPS, Memory Card.

       Fig.1: HDI PCB (1+N+1)

Simple HDI PCB

HDI PCB (2+N+2): Moderate Complex HDI

  • This structure of HDI PCB contains 2 or more “build-up” of high-density interconnection layers; microvias on different layers can be staggered or stacked; Copper filled stacked microvia structures are commonly seen in challenging designs that demand high level signal transmission performance.
  • These are suitable for BGA with smaller ball pitch and higher I/O counts and can be used to increase routing density in a complicated design while maintaining a thin finished board thickness.
  • Applications: Cell phone, PDA, game console, portable video recording devices.

      Fig.2: HDI PCB (2+N+2)

Moderate Complex HDI PCB

ELIC (Every Layer Interconnection): Most Complex HDI

  • In this HDI PCB structure, all the layers are high-density interconnection layers which allow the conductors on any layer of the PCB to be interconnected freely with copper filled stacked microvia structures.
  • This provides a reliable interconnect solution for highly complex large pin-count devices, such as CPU and GPU chips utilized on handheld and mobile devices while producing superior electrical characteristics.
  • Applications: Cell phone, ultra-mobile PC, MP3, GPS, Memory cards, small computer devices.

      Fig.3: ELIC (Every Layer Interconnection)

Every Layer Interconnection HDI PCB

Contact Details

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WhatsApp : +8613826589739