| Place of Origin: | China |
|---|---|
| Brand Name: | WITGAIN PCB |
| Certification: | UL |
| Model Number: | PCB000371 |
| Minimum Order Quantity: | 1pcs/lot |
| Price: | negotiable |
| Packaging Details: | Vacuum package in bubble wrap |
| Delivery Time: | 20 days |
| Payment Terms: | T/T |
| Supply Ability: | 100kpcs/Month |
| Layer Count: | 10 Layer | Copper Thickness: | 1 OZ On Each Layer |
|---|---|---|---|
| Drawing File Format: | Gerber Or PCB | Min BGA Size: | 12 Mil |
| Min Trace: | 3.1 Mil | Finished Thickness: | 1.0 MM |
| High Light: | 12 mil Aluminum Base PCB,10 Layer Aluminum Base PCB,1 OZ Copper PCB |
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Printed Circuit Boards 10 Layer PCB With 1 OZ Copper On Each Layer
PCB Specifications:
1 All dimensions are in MM.
2 Fabricate per IPC-6012A Class2.
3 Materials:
3.1 Dielectric: FR4 Per IPC or equivalent
3.2 Min Tg: 170DEG
3.3 Copper: As per stack up
3.4 UL Rating: 94V0 Minimum
4 Surface finish: ENIG
5 Solder mask material should meet all requirement of the IPC-SM-840E and shall be green in color and applied over bare copper. Vendor may edit solder mask and paste mask as needed.
6 Editing of existing copper layers shall require customer approval.
7 Silkscreen legend to be applied per layer stackup using white non-conductitive epoxy ink.
8 100% continuity testing using database netlist shall be performed.Vendor to identify test passed in secondary side.
9 Vendor to mark date code and logo in legend secondary side.
10 Bow and twist shall not exceed 1.0% of longest side.
11 Vendor to provide panel drawing for customer approval before production.
S1130 Data Sheet:
| S1130 | |||||
| Items | Method | Condition | Unit | Typical Value | |
| Tg | IPC-TM-650 2.4.25 | DSC | ℃ | 135 | |
| Td | IPC-TM-650 2.4.24.6 | 5% wt. loss | ℃ | 310 | |
| CTE (Z-axis) | IPC-TM-650 2.4.24 | Before Tg | ppm/℃ | 65 | |
| After Tg | ppm/℃ | 310 | |||
| 50-260℃ | % | 4.5 | |||
| T260 | IPC-TM-650 2.4.24.1 | TMA | min | 13 | |
| T288 | IPC-TM-650 2.4.24.1 | TMA | min | <1 | |
| Thermal Stress | IPC-TM-650 2.4.13.1 | 288℃, solder dip | -- | 60S No Delamination | |
| Volume Resistivity | IPC-TM-650 2.5.17.1 | After moisture resistance | MΩ.cm | 4.8E + 08 | |
| E-24/125 | MΩ.cm | 4.6E + 06 | |||
| Surface Resistivity | IPC-TM-650 2.5.17.1 | After moisture resistance | MΩ | 5.2E + 07 | |
| E-24/125 | MΩ | 5.3E + 06 | |||
| Arc Resistance | IPC-TM-650 2.5.1 | D-48/50+D-4/23 | s | 120 | |
| Dielectric Breakdown | IPC-TM-650 2.5.6 | D-48/50+D-4/23 | kV | 60 | |
| Electrical Strength | IPC-TM-650 2.5.6.2 | D-48/50+D-4/23 | kV/mm | — | |
| Dissipation Constant (Dk) | IPC-TM-650 2.5.5.9 | 1MHz | -- | 4.6 | |
| IEC 61189-2-721 | 10GHz | -- | — | ||
| Dissipation Factor (Df) | IPC-TM-650 2.5.5.9 | 1MHz | -- | 0.016 | |
| IEC 61189-2-721 | 10GHz | -- | — | ||
| Peel Strength(1oz HTE copper foil) | IPC-TM-650 2.4.8 | A | N/mm | — | |
| After thermal Stress 288℃,10s | N/mm | 1.8 | |||
| 125℃ | N/mm | 1.6 | |||
| Flexural Strength | LW | IPC-TM-650 2.4.4 | A | MPa | 600 |
| CW | IPC-TM-650 2.4.4 | A | MPa | 500 | |
| Water Absorption | IPC-TM-650 2.6.2.1 | E-1/105+D-24/23 | % | 0.15 | |
| CTI | IEC30112 | C-48/23/50, | ℃ | PLC 3 | |
| Flammability | UL94 | C-48/23/50 | Rating | V-0 | |
| E-24/125 | Rating | V-0 | |||
Multilayer PCB Process:
