| Place of Origin: | China |
|---|---|
| Brand Name: | WITGAIN PCB |
| Certification: | UL |
| Model Number: | CeramicPCB0001 |
| Minimum Order Quantity: | 1 pcs/lot |
| Price: | negotiable |
| Packaging Details: | Vacuum bubble bag packaging |
| Delivery Time: | 20 days |
| Payment Terms: | T/T |
| Supply Ability: | 100k pcs/month |
| Place Of Origin:: | Guangdong China | Material:: | Al203 Ceramic |
|---|---|---|---|
| No Of Layers:: | 2 Layer | Copper Thickness: | 105/105um |
| Surface Technics:: | ENIG | Board Size: | 120mm*100mm |
| High Light: | AL2O3 Copper PCB Board,Ceramic Copper PCB Board,2.3MM pcb copper plate |
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AL2O3 Ceramic PCB Board Thickness 2.3MM 105UM Copper
Main Features:
1 Part NO: CeramicPCB0001
2 Layer Count: 2 Layer PCB
3 Material Kind: AL203 Ceramic
4 Finished Board Thickness: 2.3MM
5 Copper Thickness: 105/105um
6 PCB Size: 120MM*100MM
7 Application Area: RF Power Supply
Our Product Categories:
| Our Product Categories | ||
| Material Kinds | Layer Counts | Treatments |
| FR4 | Single Layer | HASL Lead Free |
| CEM-1 | 2 Layer/Double Layer | OSP |
| CEM-3 | 4 Layer | Immersion Gold/ENIG |
| Aluminum Substrate | 6 Layer | Hard Gold Plating |
| Iron Substrate | 8 Layer | Immersion Silver |
| PTFE | 10 Layer | Immersion Tin |
| PI Polymide | 12 Layer | Gold fingers |
| AL2O3 Ceramic Substrate | 14 Layer | Heavy copper up to 8OZ |
| Rogers, Isola high frequency materials | 16 Layer | Half plating holes |
| Halogen free | 18 Layer | HDI Laser drilling |
| Copper based | 20 Layer | Selective immersion gold |
| 22 Layer | immersion gold +OSP | |
| 24 Layer | Resin filled in vias | |
FAQ:
Q1:What is the Thermal Resistance of a PCB?
A1: Thermal Resistance is a property of a printed circuit board that specifies its resistance to heat dispersion. A low thermal resistance in a PCB makes the dispersion of heat easier. This is basically the inverse of thermal conductivity. The thermal resistance of a PCB can be calculated by evaluating all the layers of the board and the heat parameters of the material.
To find the total thermal resistance for your board, you must include all layers of the board and the associated heat parameters for the type of material through which heat will flow.
[Formula]
R_theta = absolute thermal resistance (K/W) across the thickness of the sample
Delta x = thickness (m) of the sample (measured on a path parallel to the heat flow)
k = thermal conductivity (W/(K·m)) of the sample
A = cross-sectional area (m2) perpendicular to the path of heat flow
In addition to the thermal resistance of the board. The Thermal resistance of Vias must also be calculated. This usually depends on the copper trance, the laminate and the substrate and their respective thermal resistivities.
How can you reduce the Thermal Resistance of a PCB?
