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105UM AL2O3 Ceramic Plate Copper PCB Board Thickness 2.3MM

Basic Information
Place of Origin: China
Certification: UL
Model Number: CeramicPCB0001
Minimum Order Quantity: 1 pcs/lot
Price: negotiable
Packaging Details: Vacuum bubble bag packaging
Delivery Time: 20 days
Payment Terms: T/T
Supply Ability: 100k pcs/month
Detail Information
Place Of Origin:: Guangdong China Material:: Al203 Ceramic
No Of Layers:: 2 Layer Copper Thickness: 105/105um
Surface Technics:: ENIG Board Size: 120mm*100mm
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AL2O3 Copper PCB Board


Ceramic Copper PCB Board


2.3MM pcb copper plate

Product Description

AL2O3 Ceramic PCB Board Thickness 2.3MM 105UM Copper
Main Features:
1 Part NO: CeramicPCB0001
2 Layer Count: 2 Layer PCB
3 Material Kind:  AL203 Ceramic
4 Finished Board Thickness: 2.3MM
5 Copper Thickness: 105/105um
6 PCB Size: 120MM*100MM
7 Application Area: RF Power Supply
Our Product Categories:

Our Product Categories
Material KindsLayer CountsTreatments
FR4Single LayerHASL Lead Free
CEM-12 Layer/Double LayerOSP
CEM-34 LayerImmersion Gold/ENIG
Aluminum Substrate6 LayerHard Gold Plating
Iron Substrate8 LayerImmersion Silver
PTFE10 LayerImmersion Tin
PI Polymide12 LayerGold fingers
AL2O3 Ceramic Substrate14 LayerHeavy copper up to 8OZ
Rogers, Isola high frequency materials16 LayerHalf plating holes
Halogen free18 LayerHDI Laser drilling
Copper based20 LayerSelective immersion gold
 22 Layerimmersion gold +OSP
 24 LayerResin filled in vias

Q1:What is the Thermal Resistance of a PCB?
A1: Thermal Resistance is a property of a printed circuit board that specifies its resistance to heat dispersion. A low thermal resistance in a PCB makes the dispersion of heat easier. This is basically the inverse of thermal conductivity. The thermal resistance of a PCB can be calculated by evaluating all the layers of the board and the heat parameters of the material.
To find the total thermal resistance for your board, you must include all layers of the board and the associated heat parameters for the type of material through which heat will flow.
R_theta = absolute thermal resistance (K/W) across the thickness of the sample
Delta x = thickness (m) of the sample (measured on a path parallel to the heat flow)
k = thermal conductivity (W/(K·m)) of the sample
A = cross-sectional area (m2) perpendicular to the path of heat flow
In addition to the thermal resistance of the board. The Thermal resistance of Vias must also be calculated. This usually depends on the copper trance, the laminate and the substrate and their respective thermal resistivities.
How can you reduce the Thermal Resistance of a PCB?

  • Thermal resistance can be reduced by increasing the thickness of the copper traces.
  • Another method to decrease the thermal resistance is to place copper pads below the hot components. The high thermal conductivity of copper provides a low resistance path for the dispersion of heat. These pads can be connected to an internal ground plane through vias, which have good thermal conductivity and thus help move heat away from the component.
  • Using Heat Sinks can help lower the thermal resistivity of the board.


Contact Details

Phone Number : +8613826589739

WhatsApp : +8613826589739