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FR4 TG150 8 Layer PCB Blue Solder Mask ENIG Rigid Flex Circuit Board

Basic Information
Place of Origin: China
Brand Name: WITGAIN PCB
Certification: UL
Model Number: PCB00041
Minimum Order Quantity: 1 pcs/lot
Price: negotiable
Packaging Details: Vacuum bubble bag packaging
Delivery Time: 20 days
Payment Terms: T/T
Supply Ability: 100k pcs/month
Detail Information
No Of Layers:: 8 Layer Material:: FR4 TG150
PCB Thickness: 1.6 MM Solder Mask Colour:: Blue Solder Mask
Surface Technics:: ENIG 1U' Copper Thickness: 1/H/H/H/H/H/H/1 OZ
High Light:

TG150 8 Layer PCB

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FR4 8 Layer PCB

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ENIG Rigid Flex Circuit Board


Product Description

8 Layer PCB Used In GPS Module Blue Solder Mask ENIG

 

 

Main Features:

 

1 8 Layer Printed Circuit Board with very high relability.

2 PCB drawing size is 118.8mm*115mm/12pcs

3 Copper thickness is 35 um on each layer

4 FR4 substrate material ,TG150 degree.

 

 

FAQ:

 

Q1:What is PCB Grid Testing or Bed of Nails Testing?

A1: Grid testing or Bed of Nails testing is a process used to check the performance of components mounted on a PCB board. This test uses a frame/fixture that contains various pins inserted into an epoxy phenolic glass cloth laminated sheet (G-10) in order to access all the PCB test points. These pins act as sensors which are aligned to make contact with the test points on the PCB board and are also connected with a measuring unit through wires. The position of the pins is designed and customized for each PCB based on the components or points on the board that need to be tested.

FR4 TG150 8 Layer PCB Blue Solder Mask ENIG Rigid Flex Circuit Board 0

Limitations of PCB Grid Testing:

  • Fixtures used in bed of nails testing are expensive since they are mechanical and require a different wiring assembly for a different PCB board
  • Fixtures are mechanical so any change in the number of pins or their position require extra cost
  • This test doesn’t test continuity through connectors so there are the chances that the connectors’ faults may remain unnoticed.
  • Faults related to solder joints, excess solder, solder quality, and solder void also remain unidentified

This type of testing is called In-Circuit Testing. Another test process used for In-Circuit testing is Flying Probe Testing.

 

 

 

 

 

 

Contact Details
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